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Headphones
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Sound
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Other
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BES2300Z
Product Classification:
Features: in-ear detection, sliding touch, 3-board soft and hard combination board
Release time:
2024/08/26
Product Details
1. in-ear detection technology
1. Technical principles
In-ear detection means that the headset detects whether the headset has been correctly inserted into the user's ear through a built-in sensor. This technology is based on the principle of sound transmission or the principle of capacitance induction, and judges the wearing state by detecting the frequency and amplitude changes of the sound or the capacitance changes between the human body and the earphone.
2. sliding touch technology
1. Technical characteristics
The sliding touch technology allows the user to control the headset, such as adjusting the volume, switching songs, etc., through the sliding operation of the finger on the headset housing. This technology improves the user's interactive experience and makes the operation more convenient.
2. Implementation mode
Using a touch electrode: a touch electrode is disposed inside the earphone housing, and a touch sensing capacitance is generated by a user's finger contacting the touch electrode. The touch electrode may be designed as a slider to support a sliding operation.
Software algorithm support: through the software algorithm to identify the touch gesture, and convert it into the corresponding control instructions.
Soft and hard joint plate of 3. 3 connecting plate
1. Structural characteristics
Rigid-Flex PCB combines the advantages of rigid board and flexible board, and can realize the mixed design of rigid and flexible areas on the same board. For in-ear headphones, a more compact and flexible design can be achieved by using a hard and soft combination board with three connecting boards.
2. Application advantages
Design flexibility: The hard and soft combination board can realize multi-angle bending and complex three-dimensional structure design to meet the special requirements of in-ear headphones for spatial layout.
Weight reduction: By reducing the use of rigid boards and optimizing the design of flexible boards, the overall weight and thickness of the headset can be reduced.
Improve reliability: The hard and soft combination board can still maintain good electrical and mechanical properties when bent and twisted, and improve the durability and reliability of the headset.
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SHENZHEN BOOMTECH INDUSTRIAL SHARES CO., LTD
Company address: Longteng Community, Xixiang street, Bao 'an District, Shenzhen Room 905-906, Block A, Huizhi R & D Center
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